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 TC1121
100mA Charge Pump Voltage Converter with Shutdown
Features:
* Optional High-Frequency Operation Allows Use of Small Capacitors * Low Operating Current (FC = GND): - 50 A * High Output Current (100 mA) * Converts a 2.4V to 5.5V Input Voltage to a Corresponding Negative Output Voltage (Inverter mode) * Uses Only 2 Capacitors; No Inductors Required * Selectable Oscillator Frequency: - 10 kHz to 200 kHz * Power-Saving Shutdown Input * Available in 8-Pin MSOP, 8-Pin PDIP and 8-Pin Small Outline (SOIC) Packages
Package Type
8-Pin PDIP
FC CAP+ 1 2 8 V+
TC1121CPA 7 OSC GND 3 TC1121EPA 6 SHDN
4 5 VOUT
CAP-
8-Pin SOIC 8-Pin MSOP
FC 1 8 V+
Applications:
* * * * * Laptop Computers Medical Instruments Disk Drives P-Based Controllers Process Instrumentation
TC1121COA CAP+ 2 TC1121EOA 7 OSC GND 3 TC1121CUA 6 SHDN TC1121EUA
CAP- 4 5 VOUT
General Description:
The TC1121 is a charge pump converter with 100 mA output current capability. It converts a 2.4V to 5.5V input to a corresponding negative output voltage. As with all charge pump converters, the TC1121 uses no inductors saving cost, size and EMI. An on-board oscillator operates at a typical frequency of 10 kHz (at V+ = 5V) when the frequency control input (FC) is connected to ground. The oscillator frequency increases to 200 kHz when FC is connected to V+, allowing the use of smaller capacitors. Operation at sub-10 kHz frequencies results in lower quiescent NScurrent and is accomplished with the addition of an external capacitor from OSC (pin 7) to ground. The TC1121 also can be driven from an external clock NSconnected OSC. Typical supply current at 10 kHz is 50 A, and falls to less than 1 A when the shutdown input is brought low, whether the internal or an external clock is used. The TC1121 is available in 8-pin SOIC, MSOP and PDIP packages.
Device Selection Table
Part Number TC1121COA TC1121CPA TC1121CUA TC1121EOA TC1121EPA TC1121EUA Package 8-Pin SOIC 8-Pin PDIP 8-Pin MSOP 8-Pin SOIC 8-Pin PDIP 8-Pin MSOP Operating Temp. Range 0C to +70C 0C to +70C 0C to +70C -40C to +85C -40C to +85C -40C to +85C
(c) 2006 Microchip Technology Inc.
DS21358C-page 1
TC1121
Functional Block Diagram
+ CAP+ C1 - CAP-
SHDN
OSC Control
TC1121
VOUT RC Oscillator Switch Matrix C2 +
FC
OSC
V+
Logic Circuits
GND
DS21358C-page 2
(c) 2006 Microchip Technology Inc.
TC1121
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage (VDD) ............................................... 6V OSC, FC, SHDN Input Voltage .....-0.3V to (V+ + 0.3V) Output Short Circuit Duration ........................... 10 Sec. Package Power Dissipation (TA 70C) 8-Pin PDIP .............................................. 730 mW 8-Pin SOIC .............................................. 470 mW 8-Pin MSOP ............................................ 333 mW Operating Temperature Range C Suffix............................................ 0C to +70C E Suffix......................................... -40C to +85C Storage Temperature Range.............. -65C to +150C
TC1121 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 0C to 70C (C suffix), -40C to +85C (E suffix), V+= 5V 10% COSC = Open, C1, C2 = 10 F, FC = V+, SHDN = VIH, typical values are at TA = 25C unless otherwise noted. Symbol IDD ISHUTDOWN V+ VIH VIL IIN ROUT IOUT FOSC PEFF Parameter Active Supply Current Shutdown Supply Current Supply Voltage SHDN Input Logic High SHDN Input Logic Low Input Leakage Current Output Source Resistance Output Current Oscillator Frequency Power Efficiency Min -- -- -- 2.4 VDD x 0.8 -- -1 -4 -- 60 5 100 -- 93 94 -- 99 Typ 50 0.6 0.2 -- -- -- -- -- 12 100 10 200 -- 97 97 92 99.9 -- -- -- -- -- -- kHz % Max 100 1 1.0 5.5 -- 0.4 1 4 20 Units A mA A V V V A SHDN, OSC FC pin IOUT = 60 mA VOUT = more negative than -3.75V Pin 7 Open, Pin 1 Open or GND SHDN = VIH, Pin 1 = V+ FC = GND for all RL = 2k between V+ and VOUT RL = 1k between VOUT and GND IL = 60 mA to GND RL = Open Test Conditions RL = Open, FC = Open or GND RL = Open, FC = V+ SHDN = 0V
VEFF
Note 1:
Voltage Conversion Efficiency
%
Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no inputs from sources operating from external supplies be applied prior to "power up" of the TC1121.
(c) 2006 Microchip Technology Inc.
DS21358C-page 3
TC1121
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin MSOP, PDIP, SOIC) 1 2 3 4 5 6 7
PIN FUNCTION TABLE
Symbol FC CAP+ GND CAP- OUT SHDN OSC Description Frequency control for internal oscillator, FC = open, FOSC = 10 kHz typ; FC = V+, FOSC = 200 kHz typ; FC has no effect when OSC pin is driven externally. Charge-pump capacitor, positive terminal. Power-supply ground input. Charge-pump capacitor, negative terminal. Output, negative voltage. Shutdown. Oscillator control input. An external capacitor can be added to slow the oscillator. Take care to minimize stray capacitance. An external oscillator also may be connected to overdrive OSC. Power-supply positive voltage input.
8
V+
DS21358C-page 4
(c) 2006 Microchip Technology Inc.
TC1121
3.0
3.1
APPLICATIONS
Negative Voltage Converter
3.2
Changing Oscillator Frequency
The TC1121's clock frequency is controlled by four modes:
The TC1121 is typically used as a charge-pump voltage inverter. C1 and C2 are the only two external capacitors used in the operating circuit (Figure 3-1).
TABLE 3-1:
FC
OSCILLATOR FREQUENCY MODES
OSC Oscillator Frequency 10 kHz 200 kHz
2.4V to 5.5V 1 FC VIN 8
Open FC = V+ Open or FC = V+ Open
Open Open
2 CAP+ + -
OSC 7
External Capacitor See Typical Operating Characteristics External Clock External Clock Frequency
TC1121
3 4 GND CAP- SHDN 6 SHDN* VOUT C2
C1
VOUT 5 - +
The oscillator runs at 10 kHz (typical) when FC and OSC are not connected. The oscillator frequency is lowered by connecting a capacitor between OSC and GND, but FC can still multiply the frequency by 20 times in this mode. An external clock source that swings within 100 mV of V+ and GND may overdrive OSC in the Inverter mode. OSC can be driven by any CMOS logic output. When OSC is overdriven, FC has no effect. Note that the frequency of the signal appearing at CAP+ and CAP- is half that of the oscillator. In addition, by lowering the oscillator frequency, the effective output resistance of the charge-pump increases. To compensate for this, the value of the charge-pump capacitors may be increased. Because the 5 kHz output ripple frequency may be low enough to interfere with other circuitry, the oscillator frequency can be increased with the use of the FC pin or an external oscillator. The output ripple frequency is half the selected oscillator frequency. Although the TC1121's quiescent current will increase if the clock frequency is increased, it allows smaller capacitance values to be used for C1 and C2.
*SHDN should be tied to VIN if not used.
FIGURE 3-1:
Charge Pump Inverter
The TC1121 is not sensitive to load current changes, although its output is not actively regulated. A typical output source resistance of 11.8 means that an input of +5V results in -5V output voltage under light load, and only decreases to -3.8V typ with a 100 mA load. The supplied output current is from capacitor C2 during one-half the charge-pump cycle. This results in a peak-to-peak ripple of: VRIPPLE = IOUT/2(fPUMP) (C2) + IOUT (ESRC2) Where fPUMP is 5 kHz (one half the nominal 10 kHz oscillator frequency), and C2 = 150 F with an ESR of 0.2, ripple is about 90 mV with a 100 mA load current. If C2 is raised to 390 F, the ripple drops to 45 mV.
3.3
Capacitor Selection
In addition to load current, the following factors affect the TC1121 output voltage drop from its ideal value 1) output resistance, 2) pump (C1) and reservoir (C2) capacitor ESRs and 3) C1 and C2 capacitance. The voltage drop is the load current times the output resistance. The loss in C2 is the load current times C2's ESR; C1's loss is larger because it handles currents greater than the load current during charge-pump operation. Therefore, the voltage drop due to C1 is about four times C1's ESR multiplied by the load current, and a low (or high) ESR capacitor has a greater impact on performance for C1 than for C2. In general, as the TC1121's pump frequency increases, capacitance values needed to maintain comparable ripple and output resistance diminish proportionately.
(c) 2006 Microchip Technology Inc.
DS21358C-page 5
TC1121
3.4 Cascading Devices 3.5 Paralleling Devices
To produce greater negative magnitudes of the initial supply voltage, the TC1121 may be cascaded (see Figure 3-2). Resulting output resistance is approximately equal to the sum of individual TC1121 ROUT values. The output voltage (where n is an integer representing the number of devices cascaded) is defined by VOUT = -n (VIN). To reduce output resistance, multiple TC1121s may be paralleled (see Figure 3-3). Each device needs a pump capacitor C1, but the reservoir capacitor C2 serves all devices. The value of C2 should be increased by a factor of n (the number of devices).
VIN FC 2 CAP+ C1 + 3 GND VIN 8 OSC C1n SHDN* + 2 3 4 FC CAP+ GND CAP- VIN 8 OSC 7
+
TC1121
SHDN VOUT 5 "1"
TC1121
SHDN "n" VOUT 5 + C2n SHDN* VOUT
4 CAP-
+ *SHDN should be tied to VIN if not used.
C2
FIGURE 3-2:
Cascading TC1121s to Increase Output Voltage
V+IN FC 2 CAP+ + C1 3 4 GND CAP- "1" VIN 8 OSC 7 OSC C1n SHDN* 4 CAP- "n" + 2 3 FC CAP+ GND VIN 8 OSC 7
TC1121
SHDN VOUT 5
TC1121
SHDN VOUT 5 SHDN*
+ ROUT = ROUT (of TC1121)/n(number of devices) *SHDN should be tied to VIN if not used.
C2
FIGURE 3-3:
Paralleling TC1121s to Reduce Output Resistance
DS21358C-page 6
(c) 2006 Microchip Technology Inc.
TC1121
3.6 Combined Positive Supply Multiplication and Negative Voltage Conversion
Figure 3-4 shows this dual function circuit, in which capacitors C1 and C2 perform pump and reservoir functions to generate negative voltage. Capacitors C3 and C4 are the respective capacitors for multiplied positive voltage. This particular configuration leads to higher source impedances of the generated supplies due to the finite impedance of the common charge-pump driver.
VIN FC 2 + 3 CAP+ GND VIN OSC VOUT SHDN 5 6 C2 8 D1, D2 = 1N4148 D1 VOUT = VIN SHDN* +
-
+
TC1121
C1
4
CAP-
D2 + C3 + C4
VOUT = (2VIN) - (VFD1) - (VFD2)
*SHDN should be tied to VIN if not used.
FIGURE 3-4:
Combined Positive Multiplier and Negative Converter
(c) 2006 Microchip Technology Inc.
DS21358C-page 7
TC1121
4.0
4.1 4.2
PACKAGING INFORMATION
Package Marking Information Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
Package marking data not available at this time.
User Direction of Feed
Pin 1
W
P Standard Reel Component Orientation for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
Pin 1
W
P Standard Reel Component Orientation for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
DS21358C-page 8
(c) 2006 Microchip Technology Inc.
TC1121
4.3 Package Dimensions
8-Pin MSOP
Pin 1
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) Typ.
.122 (3.10) .114 (2.90) .043 (1.10) Max. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
6 Max. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
8-Pin Plastic DIP
Pin 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 Min.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
(c) 2006 Microchip Technology Inc.
DS21358C-page 9
TC1121
Package Dimensions (Continued)
8-Pin SOIC
Pin 1
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) Typ.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40) Dimensions: inches (mm)
8 Max.
DS21358C-page 10
(c) 2006 Microchip Technology Inc.
TC1121
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.
(c) 2006 Microchip Technology Inc.
DS21358C-page 11
TC1121
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: TC1121 Questions: 1. What are the best features of this document? Y N Literature Number: DS21358C FAX: (______) _________ - _________
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21358C-page 12
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21358C-page 13
WORLDWIDE SALES AND SERVICE
AMERICAS
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EUROPE
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02/16/06
DS21358C-page 14
(c) 2006 Microchip Technology Inc.


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